针对复杂电磁环境和复杂大型系统电磁干扰测量参数、测量点位及测量工况多的特点，采用传统扫频式频域测量方法具有代价高、耗时长等现实问题，提出了一种低频电磁干扰的多通道时域快速测量与信号计算方法，并研制出低频电磁干扰多通道时域快速测量系统，实验验证表明提出的测量、计算方法和研制出的测量系统可以准确得到复杂电磁环境和大型系统的低频电磁干扰特性，且测量速度快、成本低。

自从尺寸依赖的上转换荧光热增强现象在稀土激活的纳米荧光材料中被发现以来，开发具有显著荧光热增强效应的稀土荧光材料俨然成为了一个研究热点。近期的探索发现荧光热增强效应在非纳米尺度稀土荧光材料体系以及非上转换发光过程中均可实现，这进一步拓展了这一有趣光学现象的应用场景。本文总结和归纳了稀土激活荧光热增强材料的最新研究进展，概述了所提出的几类机理以及稀土荧光热增强材料的潜在应用场景，并展望了该类材料的研究发展方向。

研究动态调强放疗方式下多叶准直器角度改变对左侧全乳大分割放疗内侧、中间和外侧瘤床同期推量的剂量学影响。选取2018年01月至2023年01月间于遵义第一人民医院收治的左侧乳腺癌保乳术后行全乳大分割放疗瘤床同期推量患者60例，按瘤床位置分为内侧、中间和外侧3组，分别对比各组患者多叶准直器角度改变的放疗计划（标记为Plan-A）与多叶准直器角度为0°的原放疗计划（标记为Plan-O）的靶区、心肺剂量学参数差异。结果显示：3组患者的Plan-A较Plan-O，靶区处方覆盖（V_{处方（%）}）、适形度指数（Conformity Index，CI）和均匀性指数（Homogeneity Index，HI）均无显著差异；在内侧组采用Plan-A相较于Plan-O，左肺（V₅、V₁₀和D_mean）、心脏（V₈和D_mean）和冠状动脉左前降支（LAD）（D_max和D_mean）均降低，差异有统计学意义（p<0.05）；同时Plan-A较Plan-O，在中间和外侧组中仅外侧组LAD（D_max和D_mean）明显减小（p<0.05），其余心肺受量参数均无显著差异。准直器角度改变对左侧全乳大分割放疗瘤床推量靶区剂量学参数无明显影响，但能使内侧组患者的心肺受量较原放疗计划明显减小，故对于左侧大分割单纯全乳放疗内侧瘤床制定放疗计划建议选择改变多叶准直器角度。

为实现全固态Marx发生器中多个SiC MOSFET开关的同步驱动，设计了一种基于脉冲变压器的驱动控制电路。多路驱动信号的同步性会影响到Marx发生器的输出波形参数，因此要求驱动信号具有快脉冲前沿、低抖动特点。根据SiC MOSFET驱动原理及要求，分析了SiC MOSFET驱动电路脉冲前沿的影响因素，分析计算其相关参数，进行仿真模拟验证。设计了共初级穿芯10级串联的脉冲变压器，初次级的匝数分别为1匝和9匝，次级经正负脉冲信号调理电路后驱动10级Marx电路。实测结果表明利用脉冲变压器原边漏感与谐振电容构成的谐振电路在断续模式下，驱动功率越大，脉冲前沿越快且同步性越好。该同步驱动电路的脉冲前沿为112 ns，脉宽1～10 μs可调，频率10～25 kHz可调，满足固态Marx发生器参数调整需求。

为了满足高功率微波系统对宽频比双频辐射天线的研究需求，提出了一种可工作在C/X双频段的高功率圆极化反射阵列天线。天线单元采用介质埋藏的贴片单元形式，贴片部分由外圈的椭圆环贴片嵌套内圈的椭圆贴片组成，分别实现低频（C波段）和高频（X波段）的辐射。这种嵌套式的单元形式使得天线可以实现较宽的频比，同时由于单元采用无突变结构且单元被埋藏在介质中避免了三相点的出现，从而具有较高的功率容量。高低频段的两种贴片都采用绕轴旋转的方式来调节反射相位，可以在反射损耗较小的基础上满足360°的反射相位调节。基于以上双频辐射单元设计了一个口径尺寸为400 mm×400 mm的20×20矩形栅格排布反射阵列天线，设计结果表明天线在4.3 GHz下的增益为22.2 dBi，口径效率为40.2%，常压空气中的功率容量为10.4 MW；在10.4 GHz下的增益为29.9 dBi，口径效率为40.5%，常压空气中的功率容量为12.2 MW。该天线高低工作频率的频比达到2.4，且具有高效率和高功率容量的特点。

Overview: Microstructure sensor is a kind of sensor with a 2D or 3D micron-scale structure prepared by advanced manufacturing technology. It is used as a sensitive part to enhance the transmission characteristics of physical, chemical, and biological signals to the environment, and convert the external signals into electrical signals. The microstructure is generally a regular or disordered structure, usually in the shape of microspheres, microcolumns, microcones, microgrooves and micropores. The microstructures with different shapes can realize the functions of puncture, pressure transmission, vibration transmission, drug transmission, bioelectric transmission, heat transmission, sound transmission, gas adsorption, and so on. In recent years, researchers from all over the world have gradually attached great importance to the research on the manufacturing technology of microstructure sensors. At present, researchers have proposed the MEMS manufacturing processes, such as reactive ion etching and chemical vapor deposition, to achieve mass manufacturing of high-precision microstructures on flexible polymer materials and rigid materials. In addition, some researchers have also proposed the manufacturing processes such as template method, self-assembly, nanoimprinting, and soft lithography to realize microstructure manufacturing. However, the above-mentioned manufacturing processes usually cannot prepare microstructure in one step, which has the problems of complex process, high production cost, limited processing materials, and unable to control the microstructure morphology. In contrast, laser manufacturing technology has the advantages of non-contact processing, no mask, customizable manufacturing, etc. By optimizing the parameters of laser process (such as laser power, scanning speed, filling mode and scanning path), it can achieve efficient and low-cost manufacturing of microstructures with different sizes and shapes. Therefore, using laser manufacturing technology to realize microstructure manufacturing and applying it to bioelectricity, temperature, and pressure sensors has become a research hotspot in microstructure sensor manufacturing technology. Laser manufacturing technology mainly includes laser ablation, laser direct writing, laser induction, laser-template processing, etc. Laser ablation is an auxiliary heating process based on the thermochemical and thermophysical effects of a laser beam, which melts the materials to be processed to realize structural forming. Laser direct writing is a manufacturing process that focuses high-energy photon beams on the materials to be processed to produce a photochemical process, and manufacturing the structures through material removal. Laser-induced modification is a manufacturing process to change the physical and chemical properties of the materials to be processed. Laser-template processing is a manufacturing process that uses a laser to produce microstructure molds on silicon, glass, polymer, and other substrates, and then uses soft lithography technology to reverse die the structures on the molds. Based on the interaction between the laser and materials, the induction, removal, and migration of materials to be processed can be realized. By adjusting the laser processing mode and processing parameters, the controlled manufacturing of the 2D or 3D microstructures or the controlled preparation of functional materials for the sensitive units can be realized, breaking through the limitations of efficiency and cost of traditional manufacturing methods for microstructures. In this paper, the types, functions, and manufacturing technologies of microstructures are summarized and classified. The preparation processes of laser manufacturing technology and other advanced manufacturing technologies of microstructures are summarized. The applications of microstructure sensors prepared by laser ablation, laser direct writing, laser induction, and laser-template processing technology in bioelectric sensing, temperature sensing, and pressure sensing are described in detail. Finally, the development trend of the laser manufacturing technology for microstructure sensors is summarized and prospected.